SMT BGA制程工艺术语清单

1. AABUS:?As Agreed Upon Between User
and Supplier
由供需双方协商确定

2. ASIC:?Applications Specific IC
专用集成电路

3. ASM:?Array Surface Mount
阵列表面贴装

4. ASMP:?Application Specific Module Packaging
专用模块封装

5. AXI:?Automatic X-Ray Inspection
自动X射线检查

6. BGA:?Ball Grid Array
球栅阵列

7. BOC:? Board-On-Chip
芯片上板子直装

8. BT:?Bismaleimide-Triazine
双马来酰亚胺三嗪

9. CAGE:?Commercial and Government Entity
商业及政府机构

10. CBGA:?Ceramic Ball Grid Array
陶瓷球栅阵列

11. CCGA:?Ceramic Column Grid Array
陶瓷柱栅阵列

12. CGA:?Column Grid Array
柱栅阵列

13. COB: Chip-On-Board
板上芯片直装

14. CPU:?Central Processing Unit
中央处理器

15. CSP:?Chip Scale Packages
芯片尺寸封装

16. CTE:?Coefficient of Thermal Expansion
热膨胀系数

17. CTF:?Critical To Function
关键功能

18. DBDPE:?Decabromodiphenyl Ether
十溴联苯醚

19.DDR-SDRAM：Double-Data-Rate Synchronous
Dynamic Random Access Memory
双倍速率同步动态随机存取存储器

20.Df:? Dissipation Factor
损耗因子

21.DfM: Design for Manufacturability
可制造性设计

22.DfR:? Design for Reliability
可靠性设计

23. DIG:? Direct Immersion Gold
直接浸金

24. Dk: Dielectric Constant
介电常数

25. DMA: Dynamic Mechanical Analysis
动态力学分析

26. DSBGA: Die-Size Ball Grid Array
芯片尺寸球栅阵列

27. DSC:? Differential Scanning Calorimetry
差分扫描热量测定法

28. DSP: Die Size Package
芯片尺寸封装

29. dT:? Temperature Differential
温差

30. ECM: Electrochemical Migration Test
电化学迁移测试

31. ENEPIG:? Electroless Nickel/Electroless
Palladium/Immersion Gold
化学镀镍/化学镀钯/浸金

32. ENIG:? Electroless Nickel Immersion Gold
化学镀镍浸金

33. ESD:? Electrostatic Discharge/
Electrostatic Device
静电放电/静电装置

34. ESS：Environmental Stress Screening
环境应力筛选

35. EU:? European Union
欧盟

36. FAT:? Flux Activation Time
助焊剂活化时间

37.?FBGA: Fine Pitch Ball Grid Array
密节距球栅阵列

38. FC:? Flip Chip
倒装芯片

39. FPT:? Fine Pitch Technology
密节距技术

40. FRBGA:? Fine-Pitch, Rectangular Ball Grid Array
密节距,矩形球栅阵列

41. FT:? Functional Test
功能测试

42. GAC: Grid Array Component
格栅阵列器件

43. HASL:? Hot Air Solder Level
热风焊料整平

44. HAST:? Highly Accelerated Stress Testing
高加速应力测试

45. HCI:? Hydrochloric
氯化氢的

46. HDB:? High Density Printed Boards
高密度印制板

47. HF:? Hydrofluoric
氢氟酸的

48. HoP: Head-on-Pillow
枕头效应

49. I/O:? Input/Output
输入/输出

50. ICT:? In-Circuit Test
在线测试

51. ILC:? Independent Loading Mechanism
独立加载机构

52. IMC:? Intermetallic Compound
金属间化合物

53. IR:? Infrared
红外线

54. LCP:? Liquid Crystal Polymer
液晶聚合物

55. LFBGA: Low-Profile Fine-Pitch Ball Grid Array
小外形密节距球栅阵列

56. LMC:? Least Material Condition
最小实体条件

57.?LTD: Liquidus Time Delay
液相时间延迟

58. MCM: Multichip Module
多芯片模块

59. MCM-L:? Multichip Module-Laminate
多芯片模块-层压板

60. MCP:? Multichip Package
多芯片封装

61. MD:? Metal Defined
金属限定

62. MDA:? Manufacturing Defect Analyzer
制造缺陷分析仪

63. MDS:? Multi Device Subassembly
多器件子组件

64. MLC:? Multilayer Ceramic
多层陶瓷

65. MMB:? Moisture Membrane Bag
湿薄膜袋

66. MMC:? Maximum Material Condition
最大实体条件

67. NAND:?Not “And”
非“与”

68.NSMD:??Nonsolder Mask Defined
非阻焊膜限定

69. OEM:? Original Equipment Manufacturer
原始设备制造商

70. OSP:? Organic Solderability Preservative
有机可焊性保护剂

71. PBB:? Polybrominated Biphenyl
多溴化联苯

72. PBBO:? Polybrominated Biphenyl Oxide
多溴化联苯氧化物

73. PBDE:? Polybrominated Diphenyl Ether
多溴二苯醚

74. PBGA: Plastic Ball Grid Array
塑封球栅阵列

75. PCA:? Printed Circuit Assembly
印制电路组件

76. PCB:? Printed Circuit Board
印制电路板

77.?PCM:? Phase Change Materials
相变材料

78. PCMCIA:? Personal Computer Memory Card
International Association
个人计算机存储卡国际协会

79. PGA:? Pin Grid Array
针栅阵列

80. PLCC:? Plastic Leaded Chip Carrier
塑料有引线芯片载体

81. PSA:? Pressure Sensitive Adhesives
压敏粘合剂

82. PTH:? Plated Through-Hole
镀通孔

83. QFP:? Quad Flat Pack
方形扁平封装

84. RDS:? Rectangular Die Size
矩形芯片尺寸

85. RF:? Radio Frequency
射频

86. RFID:? Radio Frequency Identification
射频识别

87. RMS:? Root Mean, Square
均方根

88. RoHS: Restriction of Hazardous Substances
有害物质限制

89. RSS:? Ramp-Soak-Spike
升温-保温-峰值

90. RTS:? Ramp-to-Spike
升温至峰值

91. SAC:? Sn/Ag/Cu
锡/银/铜

92. SDRAM:? Synchronous Dynamic Random
Access Memory
同步动态随机访问存储器

93. SGA:? Solder Grid Array
焊料栅格阵列

94. SIR:? Surface Insulation Resistance
表面绝缘电阻

95. SMD:? Solder Mask Defined
阻焊膜限定

96.?SMOBC: Solder Mask Over Bare Copper
裸铜覆阻焊膜

97. SMT:? Surface Mounting Technology
表面贴装技术

98. SO-DIMM:?Small Outline Dual In-Line
Memory Module
小外形双列直插存储模块

99. SOIC:? Small Outline Integrated Circuit
小外形集成电路

100. SPC:? Statistical Process Control
统计过程控制

101. SRAM:? Static Random Access Memory
静态随机存取存储器

102.?SSO:? Simultaneously Switching Output
同步开关输出

103. STII:? Soldering Temperature Impact Index
焊接温度影响指数

104. TAB:? Tape-Automated Bonding
载带自动键合

105. TAL:? Time Above Liquidus
液相线上时间

106. TBBPA:? Tetrabromobisphenol A
四溴双酚A

107. TBGA:? Tape Ball Grid Array
载带球栅阵列

108. Td:? Decomposition Temperature
分解温度

109. TFBGA:? Thin Profile Fine Pitch Ball Grid Array
薄外形细节距球栅阵列

110. Tg: Transition Temperature
转变温度

111. TIM:? Thermal Interface Materials
热界面材料

112. TMA:? Thermal Mechanical Analysis
热机械分析

113. UFPT:? Ultra Fine Pitch Technology
超密节距技术

114. UtRAM:? Uni-transistor Random Access Memory
单一晶体管随机存取存储器

115.?UUT:? Unit Under Test
被测单元

116. UV:? Ultraviolet
紫外线

117. VFBGA:? Very Thin-Profile Fine-Pitch Ball
Grid Array
极薄外形细节距球栅阵列

118. WEEE:? Waste in Electrical and Electronic
Equipment
废弃电子电器设备

119. ZIF:? Zero Insertion Force
零插拔力