衬底耦合的建模和分析

caroline11

Substrate coupling in integrated circuits is the process whereby parasitic current flow in the substrate electrically couples devices in different parts of the circuit. Higher levels of integration and higher frequencies of operation make the coupling more pronounced in modern circuit realizations. High levels of integration are desirable in several applications for reducing the overall power dissipation, reducing the number of components and lowering costs. Portable radio-receivers are an example of such an application. Electrical coupling in the substrate leads to undesirable interaction between devices which can degrade circuit performance. The degradation can manifest itself in several ways. In mixed analog-digital circuits, for example, the switching-noise generated by digital circuits can be coupled to the sensitive analog circuits through the substrate。